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Quality and Technology

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PCBA Capability

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Item Volume Prototype / small volume
PCB specification of SMT operation Length * Width Minimum 50*30 L<50 or W<30
Maximum 450*350 800≥L>450 or 400≥W>350
Thickness Thinnest 0.8 T<0.8
Thickest 5 T>5
PCB specification of DlP operation Length * Width Minimum 50*30 L<50
Maximum 500*300 1000≥L>500 or 450≥W>300
Thickness Thinnest 0.8 T<0.8
Thickest 5 T>5
Specification of SMT component Outline size Minimum specifications 0603(0201) 0602(01005)
Maximum size 45*45 45*45<Size≤68*68(45*150)
Thickness of component 25.4 T>25.4
QFP/SOP/SOJ/IC Socket etc. Minimum distance of PIN Pitch=0.4 Pitch=0.3
CSP,BGA Minimum distance of BGA Ball Pitch=0.5 0.3≤Pitch<0.5