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Quality and Technology

Serve you with high-quality products

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PCB Technical capability

Items Standard Advanced
Laminates CEM-3、PTFE
FR-4(normal TG, middle TG, High TG etc)
Metal Base(Al,Cu etc)
Rogors,etc
 Surface Treatment HASL(Lead Free)
Immersion Gold
Gold Plating
OSP
Immersion Tin
Immersion Silver
HASL&Gold Finger
MAX．Layers 20(Layers) 30(Layers)
MAX.Board Size 22"X24" 24"X28"
Board Thickness 0.4mm~6.0mm <0.4mm or >8.0mm
Max.Copper Thickness Inner Layer:5oz inner Layer:6oz
Outer Layer:10oz Outer Layer:12oz
Min.Track Width 3mil／0.075mm 3mil／0.075mm
Min．Track Space 3mil／0.075mm 3mil／0.075mm
Min Hole Size 8mil／0.2mm 6mil／0.15mm
Min Laser Hole Size 4mil／0.1mm 3mil／0.075mm
Blind hole YES YES
Press fit hole YES YES
Control Depth drilling YES YES
PTH Wall Thickness 0.8mil／20um 1.2mil／30um
PTH Tolerance ±3mil/±0.075mm ±2mil/±0.05um
Aspect Ratio 12﹕1 14﹕1
lmpedance Control ±8% ±5%
Minimum solder mask dam width 0.09mm (3.5 mil) 0.075mm(3 mil)
Minimum letter width 0.125mm(5 mil) 0.1mm(4mil)
 Routing Tolerance Hole to Hole ±0.0875mm(3.5 mil) ±0.075mm(3mil)
Hole to Edge ±0.127mm(5 mil) ±0.1mm(4 mil)
Edge to Edge ±0.127mm(5 mil) ±0.1mm(4 mil)