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PCB

The Future of Circuit Board Technology

4-Industry-Control-PCB-1

High Frequency PCB

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PCB Type: 4L mix lamination PCB with high frequency material
Min track/gap: 6mil/6mil
Min hole: 0.3mm
Board thickness: 1.6mm
Surface Finish: ENIG according to IPC-4552
Size:220*140mm
Copper thickness: outer 1OZ, inner: 1OZ
Material: Rogers 4350B+Shengyi 7628PP
Application: Communication
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Product Details

As a high mix, low to medium volume PCB supplier, we offer one stop service for PCB, PCB assembly, and component procurement. Just send your Gerber files and BOM list, then you only need to wait to receive your products. Contact us by info@fmxtech.com.cn immediately for your products. Our advantage on heavy copper PCB, high Frequency material PCB, high TG material PCB will be your first choice.

 

Mix Lamination PCB is one of the main products of FMX Electronic Technology Co., LTD. with good price and quality. Our company is a professional supplier(s) and manufacturers in China, with various products For sale.

Introducing our cutting-edge Mix Lamination PCB, a revolutionary solution that combines the advantages of both rigid and flexible PCB technologies. Designed to meet the evolving needs of modern electronic applications, our Mix Lamination PCB offers unparalleled versatility, durability, and performance for industries such as aerospace, automotive, telecommunications, and consumer electronics.

 

The key feature of our Mix Lamination PCB lies in its ability to integrate rigid and flexible layers within a single board. By strategically combining rigid and flexible materials, this PCB type provides the best of both worlds, allowing for the seamless integration of complex circuitry with enhanced mechanical flexibility. This unique construction enables the PCB to withstand harsh environments, vibrations, and bending stresses without compromising electrical performance, making it ideal for applications that require a high level of reliability and durability.

 

Our Mix Lamination PCB excels in delivering exceptional design flexibility, enabling engineers to create innovative and space-efficient electronic systems. The flexible layers within the board allow for intricate 3D designs, enabling the PCB to conform to non-planar surfaces, fit into tight spaces, and accommodate dynamic movement. This flexibility also simplifies routing and assembly, reducing the need for additional connectors and cables, which can improve signal integrity and overall system performance.

 

In addition to its design versatility, our Mix Lamination PCB offers excellent thermal management capabilities. The combination of rigid and flexible layers allows for efficient heat dissipation, ensuring optimal performance and reliability even in high-temperature environments. This makes it well-suited for applications that require effective heat transfer, such as power electronics, LED lighting, and automotive control systems.

 

Our Mix Lamination PCB undergoes stringent manufacturing processes to ensure exceptional quality and reliability. We utilize state-of-the-art equipment and materials to achieve precise layer alignment, controlled impedance, and consistent electrical characteristics. Advanced techniques, such as laser drilling and controlled depth drilling, are employed to create vias and interconnections that maintain the integrity of the board. Rigorous testing and inspection procedures are implemented throughout the production process to guarantee compliance with industry standards and customer specifications.

 

Furthermore, our Mix Lamination PCB can be customized to meet specific application requirements. Whether it's the number of layers, material selection, or surface finish, our engineering team works closely with customers to design and manufacture PCBs that meet their unique needs. This flexibility ensures seamless integration into a wide range of electronic devices, from compact wearables to large-scale industrial equipment.

 

In summary, our Mix Lamination PCB represents a significant advancement in PCB technology, offering a seamless blend of rigidity and flexibility for enhanced design possibilities, durability, and performance. With its exceptional versatility, thermal management capabilities, and reliability, this innovative PCB solution is poised to drive the next generation of electronic systems, enabling engineers to create more efficient, compact, and reliable products across various industries.